FAMES Pilot Line
Integrated magnetics, high-density capacitors and PMIC integration for advanced FD-SOI and 3D power delivery.
Research
Research Vision - Towards Zero-Loss Zero-Volume Power Management Systems
Research thrusts
Advanced devices & components
WBG and UWBG power-switch characterisation, advanced control and PMIC optimisation, novel magnetics and advanced capacitors.
Advanced system integration
Low-parasitic packaging, electro-thermal design, thermal management and co-integration of devices, passives and cooling structures.
Advanced modelling & design
Physics-based, mathematical and data-driven modelling, multi-objective optimisation and virtual prototyping.
Application roadmap
AI data-centre power deliveryHigh-current, fast-transient voltage regulation from rack-level conversion to processor point-of-load.
Co-packaged silicon photonicsCompact, low-noise power conversion integrated alongside electronic and photonic chiplets.
Edge AI hardwareMiniaturised, energy-efficient power management for distributed sensing and computing.
Aerospace electrical systemsLightweight, high-density and high-reliability conversion for harsh operating environments.
Biomedical electronicsMiniaturised, low-noise and safe power delivery for wearable and implantable systems.
Industrial electrificationHigh-efficiency conversion and integrated power modules for automation and distributed energy systems.
Research projects
Rinn Semiconductors
Heterogeneous integration, chiplet architectures and advanced packaging from materials to system-level applications.